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ELPEPCB® printed circuit coatings
ELPEPCB® printed circuit coatings
ELPEPCB® printed circuit coatings

Products: ELPEPCB® printed circuit coatings

The complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing

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ELPEPCB® Etch resists, plating resists and Elpemer® photoresists
ELPEPCB® Etch resists, plating resists and Elpemer® photoresists

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness

ELPEPCB® Etch resists, plating resists and Elpemer® photoresists

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness

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Elpemer® photoresists

Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution

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SD 2054
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SD 2054
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Thermal curing etch and plating resists

High-definition application by screen printing

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SD 2052 AL
Sample request
SD 2052 AL
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SD 2149 SIT-HS
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SD 2149 SIT-HS
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SD 2154 E
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SD 2154 E
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UV curing etch and plating resists

High-definition application by screen printing, alkaline-strippable

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SD 2050 UV
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SD 2050 UV
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ELPEPCB® Solder resists
ELPEPCB® Solder resists

Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion

ELPEPCB® Solder resists

Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion

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Photoimageable Elpemer® solder resists

Excellent resolution, capable of representing finest structures (ink dams), for all standard application processes, UL approvals in acc. with UL File No. E80315

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Editions 733 and 766
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Editions 733 and 766
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2467 series
Sample request
2467 series
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2491 TSW series
Sample request
2491 TSW series
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SD 2463 FLEX-HF series
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SD 2463 FLEX-HF series
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2469 SM-HF series
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2469 SM-HF series
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Thermal curing solder resists

High-definition application by screen printing, UL approvals in acc. with UL File No. E80315

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SD 2446 / SD 2496 TSW
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SD 2446 / SD 2496 TSW
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SD 2462 NB / SD 2462 NB-M series
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SD 2462 NB / SD 2462 NB-M series
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UV curing solder resists

High-definition application by screen printing, for "print and etch", UL approvals in acc. with UL File No. E80315

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SD 2368 UV-SM
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SD 2368 UV-SM
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SD 2460/201 UV-FLEX-HF series
  • Resistant to HAL and lead-free reflow soldering
  • for flexible circuits, excellent adhesion to polyimide, polycarbonate and polyester foils
  • for cross-over technology as well as organic and printed electronics
  • halogen-free in acc. with JPCA-ES01-2003 and IEC 61249-2-21
  • auxiliary products recommended: Anti-static spray HP 5500cleaning agents R 5899, R 5821 and R 5817
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SD 2460/201 UV-FLEX-HF series
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  • Resistant to HAL and lead-free reflow soldering
  • for flexible circuits, excellent adhesion to polyimide, polycarbonate and polyester foils
  • for cross-over technology as well as organic and printed electronics
  • halogen-free in acc. with JPCA-ES01-2003 and IEC 61249-2-21
  • auxiliary products recommended: Anti-static spray HP 5500cleaning agents R 5899, R 5821 and R 5817
 
ELPEPCB® Peelable solder masks
ELPEPCB® Peelable solder masks

For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process

ELPEPCB® Peelable solder masks

For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process

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SD 2950 series
  • For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
  • for printing over carbon-conductive ink
  • peelable from plated-through holes
  • suitable as masks in electroplating and other metallisation processes
  • unlimited pot/processing life, solvent-free
  • recommended for the partial covering of assembled PCBs untergoing wave soldering: Peelable solder masks of the series PSM 13.990
  • auxiliary products recommended: Cleaning agents R 5899, R 5821 and R 5817
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SD 2950 series
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  • For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
  • for printing over carbon-conductive ink
  • peelable from plated-through holes
  • suitable as masks in electroplating and other metallisation processes
  • unlimited pot/processing life, solvent-free
  • recommended for the partial covering of assembled PCBs untergoing wave soldering: Peelable solder masks of the series PSM 13.990
  • auxiliary products recommended: Cleaning agents R 5899, R 5821 and R 5817
 
ELPEPCB® Plugging Pastes
ELPEPCB® Plugging Pastes

Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing

ELPEPCB® Plugging Pastes

Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing

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SD 2361 series
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SD 2361 series
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Elpemer® VF 2467 DG
Sample request
Elpemer® VF 2467 DG
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SD 2768 NB
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SD 2768 NB
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Elpemer® VF 2469 SM-HF
Sample request
Elpemer® VF 2469 SM-HF
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ELPEPCB® Via Filler
ELPEPCB® Via Filler

Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315

ELPEPCB® Via Filler

Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315

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PP 2794 TG150
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PP 2794 TG150
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PP 2795 series
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PP 2795 series
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ELPEPCB® Marking inks
ELPEPCB® Marking inks

Exceptional covering power, very good adhesion, soldering resistant, high solids content

ELPEPCB® Marking inks

Exceptional covering power, very good adhesion, soldering resistant, high solids content

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Photoimageable Elpemer® marking inks

Blanket application by screen printing, especially suitable for pilot and low-volume series' as no complex screen stencil required, capable of representing finest details

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SD 2691 TSW
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SD 2691 TSW
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SD 2618 / SD 2698
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SD 2618 / SD 2698
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Thermal curing marking inks

High-definition application by screen printing

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SD 2696 TSW
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SD 2696 TSW
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SD 2692 T series
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SD 2692 T series
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SD 2617 series
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SD 2617 series
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UV curing marking inks

High-definition application by screen printing

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SD 2593 UV
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SD 2593 UV
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ELPEPCB® Carbon-conductive inks
ELPEPCB® Carbon-conductive inks

to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors

ELPEPCB® Carbon-conductive inks

to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors

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Carbon-conductive inks

High-definition application by screen printing, very good adhesion to flexible base material, thus also suitable for "static flex" applications, excellent mechanical resistance, resistant to Hot-Air Levelling

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SD 2842 HAL
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SD 2842 HAL
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SD 2843 HAL
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SD 2843 HAL
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ELPEPCB® Thermal transfer pastes
ELPEPCB® Thermal transfer pastes

Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating

ELPEPCB® Thermal transfer pastes

Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating

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Heatsink pastes

  • for heat transfer and heat dissipation
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HSP 4 A
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HSP 4 A
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Thermal interface paste

  • applied as Thermal Interface Material (TIM) between the printed circuit board and the heatsink or heat-dissipating casings
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TIP 2792
  • elastic, thus enabling a reliable thermal connection
  • for thermo-mechanical decoupling
  • recommended auxiliary product: Cleaning agent R 5817
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TIP 2792
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  • elastic, thus enabling a reliable thermal connection
  • for thermo-mechanical decoupling
  • recommended auxiliary product: Cleaning agent R 5817
 
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